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京东 11.11 红包
Advanced package tech. for chiplet adoption and memory integration in AI/HPC
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https://www.youtube.com/watch?v=B8n4JSdVIF8 Presented by Yan Li (Samsung) 在摩尔定律逐渐失效的情况下,采用芯片设计方法和异构集成的先进封装技术为提高现代集成电路(IC)的性能提供了一种全面的选择。开发芯片生态系统仍需付出巨大努力,包括知识产权(IP)内核、芯片到芯片(D2D)接口协议、Known Good Die (KGD)解决方案和集成电路封装技术。其中,先进的集成电路封装技术在芯片组的应用中发挥着至关重要的作用,可满足人工智能和高性能计算应用的未来计算需求。本文展示了三星半导体在先进封装技术方面的最新创新,以实现基于芯片的设计,促进芯片生态系统和 D2D 接口协议。此外,还将讨论为进一步提高能效和内存带宽而开发的下一代技术,包括混合铜键合和光子集成。
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