京东 11.11 红包
OCP China Day 2023-开放计算生态论坛
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OCP China 2024 数据中心基础设施论坛
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OCP China 2024 -- 开放计算生态论坛
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大规模 AI 集群网络技术 _ NVIDIA On-Demand
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OCP China 2024 --人工智能创新论坛
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SERDES from 224 and beyond
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Addressing the Hidden Costs of AI
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OCP China 2024 开放系统 & CXL 论坛
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AI Era Event - Marvell AI Day2024
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Optimized Storage from Supermicro and Solidigm to Accelerate Your Al Data Pipeli
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Navigating the AI ASIC Frontier Trends, Challenges, and Breakthroughs
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OCP China Day 2023-数据中心基础设施论坛
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OCP Rack & Power Project call (Aug 14, 2024)
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2024 OCP Storage Tech Talks (May 15, 2024)
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计算创新演进，探索智能未来--Intel On技术创新大会
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史陶比尔：李 鹏-液冷系统关键组件——快速连接的必要与创新
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Supercharging AI Innovation Through Purpose-Built Connectivity - Astera Labs
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NVM Express Support for CXL
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RDMA 在分布式存储中的应用 _ NVIDIA On-Demand
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OAI-UBB Universal baseboard for OCP Accelerator Module
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2024开放计算中国峰会
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CCF HPC CHINA 2022-华为高性能计算解决方案分论坛
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Intro to Advanced Packaging
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OCP China 2024 绿色计算发展论坛
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Debug ability and Debug Practices of AI GPU Systems
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Intel Xeon 6 with P-cores and Gaudi 3 AI Accelerators
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Leveraging UEC For Next Generation AI Networks
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InfiniBand the Network that Accelerates HPC and AI Environments - Try it yoursel
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清华大学：李 震-数据中心冷却系统及余热利用
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Coherent高意全光交换机现场演示
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Advanced package tech. for chiplet adoption and memory integration in AI/HPC
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Broadcom-EN141 Webinar_ RoCE Introduction
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Broadcom-Ethernet NIC Webinar Series (EN101)
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FBNIC Foundational Multi host NIC Presented by Meta
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Lenovo Blackwell-Powered ThinkSystem AI Portfolio Built
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Google TPU & other in-house AI Chips
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Datacenter Physical Automation at Meta
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OCP China Day 2023-主论坛
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Executive Session presented by AMD
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Optical Interconnect：Pathways to an Open Infrastructure for AI
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OCP China Day 2023-绿色计算发展论坛