京东 11.11 红包
High-power diode laser technology XX a retrospective on 20 years of progress
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[SPIE] Advances in diode laser bar power and reliability for disk laser pump
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[SPIE] Multi-focus beam shaping of high power multimode lasers
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[SPIE] High-power highly-efficient wavelength stabilized pumps
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[SPIE] Disk lasers: Path to compact modular designs for high performance
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[SPIE] High performance MOCVD for micro LED applications
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Development of the high power LPP-EUV light source using a magnetic field
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[SPIE] Recent progress in high-power 2-μm thin-disk lasers development
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[SPIE] High power 9 μm source for spectroscopy and HHG
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[SPIE] MOCVD technology for high-yield red μLED manufacturing
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50W 343nm THG operation of a high-repetition-rate, fs thin slab amplifier
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24吨推力超越F35，中国涡扇19发动机上市 50吨推力航程16000公里，中国轰20上市爆火
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[SPIE] Investigation of the end pump surface gain medium slab laser
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半导体物理 复旦大学蒋玉龙
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通快Thin Disk碟片激光器 加工演示 TruDisk TRUMPF
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[SPIE] Towards kW average power ultrafast thin-disk amplifiers
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[SPIE] Advances in LDs operating at 445nm for material processing applications
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[SPIE] Material systems for VECSEL gain mirrors
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郭正亮：中国半导体超级逆袭！台积电入局太深被美调查！很难相信，因为中国没有EUV！
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[SPIE] Radiation resilient quantum dot semiconductor lasers
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[SPIE] TALOC: a free-space optical (FSO) communication system
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[SPIE] Beam shaping of focused radiation of multimode lasers
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zemax教学视频 F-THETA透镜的设计方法 tw柯骏程
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[SPIE] Cutting-edge single wafer MOCVD enabling advanced nitride applications
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[SPIE] PERLA100 thin-disk laser platform: a versatile tool
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中国“红色科技”逆袭！韩国半导体、电视等产业陷入危机吗？韩国每日洞察
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[半导体] 英特尔终极大改革曝光：能否击败台积电👊🏻、辗压Nvidia？
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单片机里集成个FPGA？
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关键性推理入门 Marianne Talbot 牛津大学开放课程:教你如何和人讲道理
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[SPIE] Effects of output coupler on THz quantum-cascade VECSELs
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台积电超3nm前瞻半导体技术研发资料（NTU-TSMC联合研发中心）
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[SPIE] Advances in commercial semiconductor disk lasers
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半导体基本工艺简答（面试/复试向）
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通快Thin Disk碟片激光器 结构演示 TruDisk TRUMPF
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【半导体】目前B站最全最细的半导体工艺全套教程。从头到尾带你彻底了解芯片半导体工艺！包含半导体工艺流程介绍、IC芯片、氧化、沉积工艺、CMP等等及封装工艺圈流程
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[SPIE] EUV light source for high-NA and low-NA lithography
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[生肉] SPIE课程：Light in Action-Lasers,Cameras&Other Cool Stuff
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