V
主页
1.6. Doping
发布人
半导体掺杂的机理
打开封面
下载高清视频
观看高清视频
视频下载器
7.5. Ion implantation & diffusion
12.9. NOR FLASH
12.13. Sense amplifiers
12.11. SRAM cell
6.8. I_O pipelining
6.5. Imperfect clocks and hold time
1.5. Intrinsic silicon
6.2. CMOS latches
2.9. Enhancement load NOR
7.8. Etching & CMP
1.7. Extrinsic silicon
6.9. Internal pipelining
12.10. NAND FLASH
1.9. Drift
2.2. Preliminaries of logic
7.10. Alignment
2.7. Enhancement load inverter
4.4. Parasitic delay
5.2. Dynamic CMOS
2.1. PMOS Transistors
12.8. EPROM & EEPROM
6.1. Sequential CMOS
6.3. CMOS registers
6.12. I_O alignment in pipelines
4.6. Optimizing logic
12.12. SRAM read and write
6.7. Basics of pipelining
4.8. Complications of optimization
4.2. Inverter chains
1.2. Band model
4.1. Sizing in a chain
Android Boot Process
7.12. LOCOS part 2
7.9. Exposure strategies
5.4. Leakage in dynamic CMOS
1.11. Diffusion
7.11. LOCOS part 1
1.4. Carrier concentration
6.10. Setup-time violations
2.11. Complex enhancement synthesis